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ITO Semiconductor Aligner-Bonder
Tabletop Anisotropic Conductive Film Aligner-Bonder With Rotary Stage TTAB-1008CR
The Ito Group TTAB-1008CR/2525AR is a tabletop ACF aligner-bonder featuring a rotary table for improved throughput. It features a unique stage support mechanism which improves coplanarity and allows the machine to be used with complex 3D structures such as camera modules.The TTAB-1008CR/2525AR is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays.
The aligner-bonder powers up and controllers operate to set parameters. Removed from a working facility.
Specifications:
Substrate stage: 2 Interchangeable Stages – Max W100 x D120mm
Device stage: 2 Interchangeable Stages – Max W150 x D100mm
Heating method: Constant heat
Heat tool size: Length: 5-100mm – Width: 1-8mm
Power: AC100 – 240V, Single Phase
Product size range: W100mm x L150mm (Center Bonding Position)
Serial No: TTAB1008CR-008
YOM: 2018
Power: Single Phase 200 - 240V AC
| SKU | R022 |
|---|---|
| Availability | Out of Stock |
| Condition | Used |